Beahm 520-B Split Die Ballon Bonder (MSI Update)

The Beahm Designs Model 520-B CE Split Die Balloon Bonder is designed for the thermal bonding and welding of thermoplastic components to a variety of materials. The system utilizes precision-heated split dies and an integrated cooling chamber to protect balloons and other heat-sensitive components during the bonding process.

Unlike conventional systems that cycle heat on and off, the 520-B maintains both die heads at a constant process temperature for improved consistency and repeatability. The split-die design allows the heated die halves to open and separate, making it easy to position components within the bond area before processing.

Digital controls provide precise adjustment of bond and cooling times, while integrated tooling securely holds components in place throughout the bonding cycle. This combination of controlled heating, cooling, and positioning makes the 520-B an ideal solution for demanding catheter and medical device manufacturing applications.

(Includes All Cables, Power Cords, and Accessories Required for Operation)